Understanding Through-hole Assembly Technology

Through-hole technology refers to the mounting electronic components, which involves the use of leads on the components that are inserted into holes drilled in printed circuit board (PCB) and soldered to pads on the opposite side either by manual assembly or by the use of automatic insertion mount machines.

Through-hole Technology involves the usage of leads on the electrical component, which are inserted inside the holes drilled on the circuit board. These leads are then soldered to the pads present on the opposite side of the board. Over the years, this technology was regarded as the most reliable mounting process, as it provides strong mechanical bond between the board and the component. The technology was also used on larger components, which are designed to endure high mechanical stress. However, the considerable flaw with this technology was the additional drilling in the circuit boards, which made the boards more expensive. Also, the presence of holes in the PCBs limited the available routing area for signal traces on the layers present just under the top layer of multi-layer boards.

Conventional leaded components soldered through the PCB have been the mainstay of the electronics industry for many years, despite the continuing movement towards surface mount technology (SMT), miniaturisation and increased complexity, “Through-Hole” assembly still has a huge part to play, indeed even on predominantly surface mount assemblies there is usually an element of through hole components required.

In addition to offering the all types of through-hole assembly, MOKOPCB also offers useful additional services for final finishing of the product. Conformal coating and complete PCB encapsulation (potting are both ‘in-house’ options).

A brief summary of our through-hole and associated PCB assembly services is as follows:

  • Hand Insertion of components
  • Hand soldering
  • Automate axial or radial insertion
  • Dual wave flow solder
  • RoHS soldering or ‘legacy’ assembly using tin lead solder
  • Use of high and low melting point solder
  • Prototype build to high volume assembly
  • Functional test and automated inspection
  • Conformal coating
  • PCB encapsulation (potting)
  • Device programming

Please do not hesitate to contact us should you need further information on any of the above.

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