What MOKOPCB can do?

MOKOPCB offers the latest technical capabilities to meet your most demanding project requirements for circuit card assembly. Whether we assemble your product with BGA, Micro-BGA, Surface Mount or Through-Hole Technology , we work closely with you to ensure that you are 100% satisfied.

MOKO specializes in new product introduction for low volume production. Our technical capabilities include multiple, linked continuous flow production lines, dedicated aqueous and no-clean solder chemistry, potting and con-formal coating, and final product assembly (box builds).


PCB Manufacturing Service from MOKOPCB

Here at MOKOPCB, Standard PCB service refers to full feature printed circuit board manufacturing service. With 10+ years’ experience in PCB fabrication, we have handled hundreds of thousands of PCB projects, and covered almost all kinds of substrate material including Standard FR4, Aluminum, Rogers, etc. A defective PCB design is capable of damaging the product, thus affecting the brand value of the company. Therefore, it is always important to select the right PCB fabricator. MOKOPCB is a popular name in the market for providing printed circuit board fabrication services. The latest tools that we use to fabricate PCBs help us simplify the complex fabrication process.

To endow client’s project with expected function and more possibilities, we offer advanced features for Standard PCB services. Comprehensive capabilities can be found in the following table:

MOKO PCB Fabrication Capability

No Item PCB Process Capability
1 base material Normal TG FR4, High TG FR4, PTFE, Rogers, Low Dk/Df etc.
2 Solder mask color green, red, blue, white, yellow, purple,black
3 Legend color white, yellow, black, red
4 Surface treatment type ENIG, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger, sterling silver
5 Max. layer-up(L) 50
6 Max. unit size (mm) 620*813 (24″*32″)
7 Max. working panel size (mm) 620*900 (24″x35.4″)
8 Max. board thickness (mm) 12
9 Min. board thickness(mm) 0.3
10 Board thickness tolerance (mm) T<1.0 mm: +/-0.10mm ;  T≥1.00mm: +/-10%
11 Registration tolerance (mm) +/-0.10
12 Min. mechanical drilling hole diameter (mm) 0.15
13 Min. laser drilling hole diameter(mm) 0.075
14 Max. aspect(through hole) 15:1
Max. aspect(micro-via) 1.3:1
15 Min. hole edge to copper space(mm) L≤10, 0.15;L=12-22,0.175;L=24-34, 0.2;L=36-44, 0.25;L>44, 0.3
16 Min. Inner layer clearance(mm) 0.15
17 Min. hole edge to hole edge space(mm) 0.28
18 Min. hole edge to profile line space(mm) 0.2
19 Min. Inner layer copper to profile line space (mm) 0.2
20 Registration tolerance between holes (mm) ±0.05
21 Max. finished copper thickness(um) Outer Layer: 420   (12oz)
Inner Layer: 210   (6oz)
22 Min. trace width (mm) 0.075 (3mil)
23 Min. trace space (mm) 0.075 (3mil)
24 Solder mask thickness (um) line corner :  >8 (0.3mil)
upon copper: >10 (0.4mil)
25 ENIG golden thickness (um) 0.025-0.125
26 ENIG nickle thickness (um) 3-9
27 Sterling silver thickness (um) 0.15-0.75
28 Min. HAL tin thickness (um) 0.75
29 Immersion tin thickness (um) 0.8-1.2
30 Hard-thick gold plating gold thickness  (um) 1.27-2.0
31 golden finger plating gold thickness (um) 0.025-1.51
32 golden finger plating nickle thickness(um) 3-15
33 flash gold plating gold thickness (um) 0,025-0.05
34 flash gold plating nickle thickness  (um) 3-15
35 profile size tolerance (mm) ±0.08
36 Max. solder mask plugging hole size (mm) 0.7
37 BGA pad (mm) ≥0.25 (HAL or HAL Free:0.35)
38 V-CUT blade position tolerance (mm) +/-0.10
39 V-CUT position tolerance (mm) +/-0.10
40 Gold finger bevel angle tolerance (o) +/-5
41 Impedance tolerance (%) +/-5%
42 Warpage tolerance (%) 0.75%
43 Min. legend width  (mm) 0.1
44 Fire flame class 94V-0
Special for Via in pad products Resin plugged hole size (min.) (mm) 0.3
Resin plugged hole size (max.) (mm) 0.75
Resin plugged board thickness (min.) (mm) 0.5
Resin plugged board thickness (max.) (mm) 3.5
Resin plugged maximum aspect ratio 8:1
Resin plugged minimum hole to hole space (mm) 0.4
Can difference hole size in one board? yes
Max. panel size (finished) (mm) 880 ×580
Max. working panel size (mm) 914 × 602
Max. board thickness (mm) 12
Max. layer-up(L) 40
Aspect 30:1 (Min. hole: 0.4 mm)
Line wide/space (mm) 0.075/ 0.075
Back drill capability Yes
Tolerance of back drill (mm) ±0.05
Tolerance of  press fit holes (mm) ±0.05
Surface treatment type OSP, sterling silver, ENIG
Rigid-flex board Hole size (mm) 0.2
Dielectrical thickness (mm) 0.025
Working Panel size (mm) 350 x 500
Line wide/space (mm) 0.075/ 0.075
Stiffener Yes
Flex board layers (L) 8 (4plys of flex board)
Rigid board layers (L) ≥14
Surface treatment All
Flex board in mid or outer layer Both
Special for HDI products Laser drilling hole size (mm) 0.075
Max. dielectric thickness (mm) 0.15
Min. dielectric thickness (mm) 0.05
Max. aspect 1.5:1
Bottom Pad size (under micro-via) (mm) Hole size+0.15
Top side Pad size ( on micro-via) (mm) Hole size+0.15
Copper filling or not (yes or no) (mm) yes
Via in Pad design or not ( yes or no) yes
Buried hole resin plugged (yes or no) yes
Min. via size can be copper filled (mm) 0.1
Max. stack times 4

MOKOPCB is a well-known company when it comes to custom printed circuit board fabrication services . Our team of experts are always ready to help you with your design and fabrication needs. We assure fast turnaround times, which allows us ensure timely delivery of your PCBs. To know more about our products and services, please free to contact us on +86-75523573370. You can also mail us at nicholas@mokotechnology.com.

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