Just like FR4 PCB, we can also make boards with more than 2 layers of traces and we named it “Multi Layers MCPCB”. The structure is similar with FR4 Multi Layers, but it much more complex to make.

Multi Layers Metal Core Printed Circuit Boards are an excellent alternative to standard circuit boards, if the circuit boards are exposed to large mechanical loads, or a high level of dimensional stability is required, or high temperatures must be conducted away from power components or LED’s.

You can populated more components on the boards, put signal and ground layer into seperated layers, to achieve better performance in electrical performance.

Compared with normal FR4, this sturcture need more technology and experience on laminating of more than two layers together with metal core and the cost is much higher than 2 layers MCPCB or double sided MCPCB.

Metal core PCB
The thermal conductivity assisted by the aluminium core in the circuit boards makes higher packing densities, longer operating times, and improved security against failure possible, such as for LED technology and for high power transistors.

The integration of the cooling unit in the printed circuit board also results in space savings.
Structure of Multi Layers MCPCB

Capability of Multi Layers Metal Core Printed Circuit Boards

Base material: Aluminum/Copper/Iron Alloy
Thermal Conductivity (dielectrial layer): 0.8, 1.5, 2.0, 3.0 W/m.K.
Board Thickness: 0.8mm~3.0mm(0.02″~0.12″)
Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ
Outline: Routing, punching, V-Cut
Soldermask: White/Black/Blue/Green/Red Oil
Legend/Silkscreen Color: Black/White
Surface finishing: Immersion Gold, HASL, OSP
Max Panel size: 600*500mm(23.62″*19.68″)
Packing: Vacuum/Plastic bag
Samples L/T: 15~18 Days
MP L/T: 15~20 Days

Application of Multi Layers Metal Core Printed Circuit Boards

LED lights

High-current LED, Spotlight, high-current PCB

Industrial power equipment

High-power transistors, transistor arrays, push-pull or totem pole output circuit (to tem pole), solid-state relay, pulse motor driver, the engine Computing amplifiers (Operational amplifier for serro-motor), pole-changing device (Inverter)


firing implement, power regulator, exchange converters, power controllers, variable optical system


voltage regulator series, switching regulator, DC-DC converters


input – output amplifier, balanced amplifier, pre-shield amplifier, audio amplifier, power amplifier


Printer driver, large electronic display substrate, thermal print head


input – output amplifier, balanced amplifier, pre-shield amplifier, audio amplifier, power amplifier
Others Semiconductor thermal insulation board, IC arrays, resistor arrays, Ics carrier chip, heat sink, solar cell substrates, semiconductor refrigeration device

Please contact us for more information about the Multi layers MCPCB.

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