High Quality PCB Manufacturing Services
High Quality PCB Manufacturing Services

Our Printed Circuit Board Fabrication capabilities include a wide variety of Densities, Layer Counts, Materials, Processes and Finishes, which are used in our 25,000 sq. ft. fabrication facility located in Shenzhen,China. is an expert at PCB Manufacturering. We are specialized in manufacturing Single-Sided Boards, Double-Sided Boards and multilayer PCB, up to 18 layers. also could provide components purchase and turnkey pcb assembly service.

How to Get Quotation of Standard PCB

Free PCB quotation is just a click away. Use our instant free PCB quote., fill in corresponding parameters based on your custom PCB design, an estimated PCB fabrication price will show up in the right column within seconds

If you have any question or concern on our Custom PCB capabilities or your demanded custom circuit spec is not included in the above table, please feel free to reach our engineers at nicholas@mokotechnology.com. Tell our experts what you need and we will provide you with the right PCB fabrication and PCB assembly solution. We are ready and eager to turn your concepts into reality.

To endow client’s project with expected function and more possibilities, we offer advanced features for Standard PCB services. Comprehensive capabilities can be found in the following table:

MOKO PCB Manufacturing Capability

No Item PCB Process Capability
1 base material Normal TG FR4, High TG FR4, PTFE, Rogers, Low Dk/Df etc.
2 Solder mask color green, red, blue, white, yellow, purple,black
3 Legend color white, yellow, black, red
4 Surface treatment type ENIG, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger, sterling silver
5 Max. layer-up(L) 50
6 Max. unit size (mm) 620*813 (24″*32″)
7 Max. working panel size (mm) 620*900 (24″x35.4″)
8 Max. board thickness (mm) 12
9 Min. board thickness(mm) 0.3
10 Board thickness tolerance (mm) T<1.0 mm: +/-0.10mm ;  T≥1.00mm: +/-10%
11 Registration tolerance (mm) +/-0.10
12 Min. mechanical drilling hole diameter (mm) 0.15
13 Min. laser drilling hole diameter(mm) 0.075
14 Max. aspect(through hole) 15:1
Max. aspect(micro-via) 1.3:1
15 Min. hole edge to copper space(mm) L≤10, 0.15;L=12-22,0.175;L=24-34, 0.2;L=36-44, 0.25;L>44, 0.3
16 Min. Inner layer clearance(mm) 0.15
17 Min. hole edge to hole edge space(mm) 0.28
18 Min. hole edge to profile line space(mm) 0.2
19 Min. Inner layer copper to profile line space (mm) 0.2
20 Registration tolerance between holes (mm) ±0.05
21 Max. finished copper thickness(um) Outer Layer: 420   (12oz)
Inner Layer: 210   (6oz)
22 Min. trace width (mm) 0.075 (3mil)
23 Min. trace space (mm) 0.075 (3mil)
24 Solder mask thickness (um) line corner :  >8 (0.3mil)
upon copper: >10 (0.4mil)
25 ENIG golden thickness (um) 0.025-0.125
26 ENIG nickle thickness (um) 3-9
27 Sterling silver thickness (um) 0.15-0.75
28 Min. HAL tin thickness (um) 0.75
29 Immersion tin thickness (um) 0.8-1.2
30 Hard-thick gold plating gold thickness  (um) 1.27-2.0
31 golden finger plating gold thickness (um) 0.025-1.51
32 golden finger plating nickle thickness(um) 3-15
33 flash gold plating gold thickness (um) 0,025-0.05
34 flash gold plating nickle thickness  (um) 3-15
35 profile size tolerance (mm) ±0.08
36 Max. solder mask plugging hole size (mm) 0.7
37 BGA pad (mm) ≥0.25 (HAL or HAL Free:0.35)
38 V-CUT blade position tolerance (mm) +/-0.10
39 V-CUT position tolerance (mm) +/-0.10
40 Gold finger bevel angle tolerance (o) +/-5
41 Impedance tolerance (%) +/-5%
42 Warpage tolerance (%) 0.75%
43 Min. legend width  (mm) 0.1
44 Fire flame class 94V-0
Special for Via in pad products Resin plugged hole size (min.) (mm) 0.3
Resin plugged hole size (max.) (mm) 0.75
Resin plugged board thickness (min.) (mm) 0.5
Resin plugged board thickness (max.) (mm) 3.5
Resin plugged maximum aspect ratio 8:1
Resin plugged minimum hole to hole space (mm) 0.4
Can difference hole size in one board? yes
Max. panel size (finished) (mm) 880 ×580
Max. working panel size (mm) 914 × 602
Max. board thickness (mm) 12
Max. layer-up(L) 40
Aspect 30:1 (Min. hole: 0.4 mm)
Line wide/space (mm) 0.075/ 0.075
Back drill capability Yes
Tolerance of back drill (mm) ±0.05
Tolerance of  press fit holes (mm) ±0.05
Surface treatment type OSP, sterling silver, ENIG
Rigid-flex board Hole size (mm) 0.2
Dielectrical thickness (mm) 0.025
Working Panel size (mm) 350 x 500
Line wide/space (mm) 0.075/ 0.075
Stiffener Yes
Flex board layers (L) 8 (4plys of flex board)
Rigid board layers (L) ≥14
Surface treatment All
Flex board in mid or outer layer Both
Special for HDI products Laser drilling hole size (mm) 0.075
Max. dielectric thickness (mm) 0.15
Min. dielectric thickness (mm) 0.05
Max. aspect 1.5:1
Bottom Pad size (under micro-via) (mm) Hole size+0.15
Top side Pad size ( on micro-via) (mm) Hole size+0.15
Copper filling or not (yes or no) (mm) yes
Via in Pad design or not ( yes or no) yes
Buried hole resin plugged (yes or no) yes
Min. via size can be copper filled (mm) 0.1
Max. stack times 4

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