OSP Printed Circuit Board Manufacturing

OSP PCB Board Manufacturing
OSP PCB Board Manufacturing

OSP, the full name is Organic Solderability Preservative, it’s also called preflux. OSP is a kind of surface finish on bare printed circuit board that preserve the copper surface from oxidation by applying a very thin protective layer of material over the exposed copper usually using a conveyorized process. It’s a kind of surface technology in PCB fabrication that meets RoHS requirements, and it could be the alternative solution for the surface finish of HAL(Lead-free).

OSP uses a water-based organic compound that selectively bonds to copper and provides an organometallic layer that protects the copper prior to soldering. It’s also extremely green environmentally in comparison with the other common lead-free finish, which suffers from either being more toxic or substantially higher energy consumption.

OSP Finish is the leader in low-cost surface finishes. It is designed to produce a thin, uniform, protective layer on the copper surface of the PCB that shields the circuitry from oxidization during storage and assembly operations. While OSP Finish has been around for quite some time, it has only recently gained popularity as customers increase their search for Lead-free and fine pitch options.

These are the PCB surface finishes we have available for your PCB order.
For more OSP PCB Manufacturing information, please contact our experts at nicholas@mokotechnology.com or get a PCB production quote.

Gold Finish May be Electrolytic Electroless, or Immersion
– ENIG
(Electroless Nickel Immersion Gold)
2-5 micro inches. Purpose: To prevent oxidation, extend shelf life, provide a wire bonding surface (when aluminum wire is used), and used to provide an electrically conductive surface on PCBs. Used for solderability when the flatness of the pad is critical. ENIG has shelf life longer then 12 months.
– Hard Gold Purpose: Used for Gold Fingers (minimum 30 micro inches), soldering (maximum 17 micro inches), to prevent oxidation and extend shelf life.
– Soft Gold Purpose: Used for wire bonding (Ultrasonic minimum 2 micro inches/Thermasonic minimum 30 micro inches) and to prevent oxidation and extend shelf life.
Immersion Silver Use for solderability purposes (2-10 micro inches). Used for solderability when the flatness of the pad is critical.
Lead Free Solder Use for solderability purposes (2-5 micro inches). Used for solderability when the flatness of the pad is not critical.
OSP
Organic Solderability Preservatives)
Used for solderability when the flatness of the pad is critical.
White Tin (Immersion Tin) Used for solderability when the flatness of the pad is critical.

The advantages of OSP PCB Manufacturing

Basically, the advantages of using OSP surface treatment for custom PCB include Cost effective, re-workable, simple process, No Pb and a flat surface on electronic boards.

Our OSP PCB Manufacturing Samples

6 Layer OSP PCB

OSP PCB Board

Lead free OSP PCB

OSP is also one of surface finishes technology that MOKOPCB is currently using, however, a large proportion of this surface technology is used for Single-sided PCB and Double-sided PCB.

MOKOPCB delivers a motto of Redefining Customer Service and that includes all of our OSP PCB Manufacturing work. Our engineers have decades of combined experience and are able to deliver a guaranteed quality service for every step in your PCB need.

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