MOKOPCB offers ENEPIG PCBs that are finished with Electroless Nickel, Electroless Palladium, Immersion Gold which is one of the more optimum choices for wire bonding as well as most PCB applications.

ENEPIG Circuit Boards
ENEPIG Circuit Boards

ENEPIG printed circuit boards were popular many years ago due to their overall board support and are now rising up once again thanks to a significant decrease in the cost of palladium. The design has been shown to successfully operate in conjunction with lead-free and eutectic solder alloys as well as most assembly processes.

ENEPIG Circuit Boards Technology and Manufacturing Process

Different from ENIG, ENEPIG takes four layers of metal structure including copper, nickel, palladium and gold. The process of ENEPIG is the same as that of ENIG except that electroless palladium plating is added between ENP and immersion gold.

Palladium layer is added to ENEPIG technology as a barrier layer, stopping corrosion of the nickel layer caused by solution in the process of gold deposition and diffusion from nickel layer to gold layer. Meanwhile, palladium layer can be treated as anti-oxidation layer and anti-corrosion layer because of its feature of compact to increase the solderability. Similar to electroless nickel plating, electroless palladium plating leads to the deposition of palladium layer through redox reaction with NaH2PO2 as reducing agent. The reaction formula indicating this step is shown as the follows:

H2PO2 + H2O → H+ + HPO32- + 2H

Pd2+ + 2H → Pd↓ + 2H+

H2PO2 + H → P↓ + OH + H2O

H2PO2 + H2O → H2↑ + H+ + HPO32-

Advantages of ENEPIG Circuit Boards

ENEPIG PCBs offer a few distinct advantages compared to other similar boards. The ENEPIG finish advantages include:

  • Corrosion resistance due to its multilayer design, eliminating the risk of grain boundary corrosion.
  • Lower contact resistance. The electrical resistance of this finish is uniform due to its production process and creates a situation where amperage is easier to predict and manage.
  • Pore-free finish.
  • Significantly higher bond pull strength. High pull weights are maintained through multiple tests, making it especially suited to gold ball and aluminum wedge bonding.
  • Strong solderability thanks to nickel protecting and reducing copper dissolution.
  • Supports conductive adhesives for applications that do not need or may be harmed by solder.
  • Won’t tarnish, extending its useful life.

And perhaps the best news of all is that the ENEPIG process tends to provide significant savings over electrolytic nickel gold and electroless nickel or electroless gold.

Application Fields of ENEPIG PCB

ENIG and ENEPIG application fields are different because of their different advantages. ENEPIG is capable of meeting strict requirements of multiple types of packages including THT (through-hole technology), SMT, BGA, wire bonding, press fit etc. What’s better, ENEPIG is also suitable for PCBs with different packaging technologies. As a result, application fields ENEPIG can serve include aerospace, military and high performance devices and medical industries with higher requirement of density and reliability.

MOKOPCB has created ENEPIG PCBs for a wide range of customers in the instrumentation, power, high-speed and EMS spaces. With more than 600 satisfied customers, our engineers have become masters at their craft. We welcome you to experience the benefit of working with MOKOPCB.

Welcome Order Your ENEPIG PCBs From MOKOPCB

MOKOPCB delivers a motto of Redefining Customer Service and that includes all of our ENEPIG circuit board work. Our engineers have decades of combined experience and are able to deliver a guaranteed quality service for every step in your PCB need.

We’ll walk you through prototype development, testing, achieving certifications and then through high-volume production demands, all at an attractive price. MOKOPCB can deliver your time-sensitive prototype to help you get to market and own your space.
See what the right ENEPIG PCB can do for you.

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